Veldhoven chip equipment maker ASML is partnering with top customers TSMC and Samsung to develop larger photomasks for its advanced machines. The companies aim to double mask sizes to boost productivity and lower manufacturing costs for cutting-edge semiconductors. Rapid artificial intelligence growth continues to trigger global memory chip shortages and drive up prices.
12-inch photomasks targeted for 2031 trial runs
Photomasks serve as blueprints for etching circuit patterns onto silicon wafers. Current industry standards rely on 6-inch masks, but the consortium is developing 12-inch alternatives. ASML plans to begin pilot testing the technology on its newest machines in 2031, aiming for full commercial chip production by 2033.
TSMC and Samsung commit to High-NA EUV adoption
Samsung and TSMC have confirmed firm schedules to integrate ASML’s costly High-NA EUV lithography systems into mass production. Industry observers previously questioned whether performance gains would justify the higher price tag of these next-generation machines.
Major chipmakers map out rollout timelines
Samsung intends to deploy High-NA EUV technology by 2028 for mass DRAM memory chip production. TSMC plans to introduce High-NA EUV systems to its manufacturing lines starting in 2030. American chipmaker Intel previously bought the high-resolution machinery to improve transistor density and boost production speeds.
@ anp | NEWS BRAINPORT
